Manufacturers traditionally use a thick layer of soft gold on PCBs for Gold ball wire bonding. This requires plating the Copper traces on the PCB with a layer of Nickel, followed with an electroplated layer of soft Gold, measuring about 30-50 µin in thickness. The properly plated Gold layer forming an excellent surface for wire bonding. Although the method is eminently suitable for fine-pitch Gold ball bonding, it is expensive.
About listing
| ID | 128468 |
|---|---|
| Date add | 21 October 2021 6:48 AM |
| Views | 644 |
| Country | United States of America |
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| State / Province | California |
| Distance | 8,450 Kilometers |