Manufacturers traditionally use a thick layer of soft gold on PCBs for Gold ball wire bonding. This requires plating the Copper traces on the PCB with a layer of Nickel, followed with an electroplated layer of soft Gold, measuring about 30-50 µin in thickness. The properly plated Gold layer forming an excellent surface for wire bonding. Although the method is eminently suitable for fine-pitch Gold ball bonding, it is expensive.
| Link to details | Visit Link Here |
|---|---|
| Country | United States of America |
| State | California |
| Distance | 8,450 Kilometers |
| Address | 2149-20 O'Toole Ave, San Jose, CA 95131, USA |
| Category | Manufacturing |
| Keywords |